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Steven Voldman H. ESD. Analog Circuits and Design Steven Voldman H. ESD. Analog Circuits and Design Новинка

Steven Voldman H. ESD. Analog Circuits and Design

10548.03 руб.
A comprehensive and in-depth review of analog circuit layout, schematic architecture, device, power network and ESD design This book will provide a balanced overview of analog circuit design layout, analog circuit schematic development, architecture of chips, and ESD design. It will start at an introductory level and will bring the reader right up to the state-of-the-art. Two critical design aspects for analog and power integrated circuits are combined. The first design aspect covers analog circuit design techniques to achieve the desired circuit performance. The second and main aspect presents the additional challenges associated with the design of adequate and effective ESD protection elements and schemes. A comprehensive list of practical application examples is used to demonstrate the successful combination of both techniques and any potential design trade-offs. Chapter One looks at analog design discipline, including layout and analog matching and analog layout design practices. Chapter Two discusses analog design with circuits, examining: single transistor amplifiers; multi-transistor amplifiers; active loads and more. The third chapter covers analog design layout (also MOSFET layout), before Chapters Four and Five discuss analog design synthesis. The next chapters introduce the reader to analog-digital mixed signal design synthesis, analog signal pin ESD networks, and analog ESD power clamps. Chapter Nine, the last chapter, covers ESD design in analog applications. Clearly describes analog design fundamentals (circuit fundamentals) as well as outlining the various ESD implications Covers a large breadth of subjects and technologies, such as CMOS, LDMOS, BCD, SOI, and thick body SOI Establishes an “ESD analog design” discipline that distinguishes itself from the alternative ESD digital design focus Focuses on circuit and circuit design applications Assessible, with the artwork and tutorial style of the ESD book series PowerPoint slides are available for university faculty members Even in the world of digital circuits, analog and power circuits are two very important but under-addressed topics, especially from the ESD aspect. Dr. Voldman’s new book will serve as an essential and practical guide to the greater IC community. With high practical and academic values this book is a “bible” for professionals, graduate students, device and circuit designers for investigating the physics of ESD and for product designs and testing.
Steven Voldman H. ESD: Design and Synthesis Steven Voldman H. ESD: Design and Synthesis Новинка

Steven Voldman H. ESD: Design and Synthesis

11459.08 руб.
Electrostatic discharge (ESD) continues to impact semiconductor components and systems as technologies scale from micro- to nano-electronics. This book studies electrical overstress, ESD, and latchup from a whole-chip ESD design synthesis approach. It provides a clear insight into the integration of ESD protection networks from a generalist perspective, followed by examples in specific technologies, circuits, and chips. Uniquely both the semiconductor chip integration issues and floorplanning of ESD networks are covered from a ‘top-down' design approach. Look inside for extensive coverage on: integration of cores, power bussing, and signal pins in DRAM, SRAM, CMOS image processing chips, microprocessors, analog products, RF components and how the integration influences ESD design and integration architecturing of mixed voltage, mixed signal, to RF design for ESD analysis floorplanning for peripheral and core I/O designs, and the implications on ESD and latchup guard ring integration for both a ‘bottom-up' and ‘top-down' methodology addressing I/O guard rings, ESD guard rings, I/O to I/O, and I/O to core classification of ESD power clamps and ESD signal pin circuitry, and how to make the correct choice for a given semiconductor chip examples of ESD design for the state-of-the-art technologies discussed, including CMOS, BiCMOS, silicon on insulator (SOI), bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, and smart power practical methods for the understanding of ESD circuit power distribution, ground rule development, internal bus distribution, current path analysis, quality metrics ESD: Design and Synthesis is a continuation of the author's series of books on ESD protection. It is an essential reference for: ESD, circuit, and semiconductor engineers; design synthesis team leaders; layout design, characterisation, floorplanning, test and reliability engineers; technicians; and groundrule and test site developers in the manufacturing and design of semiconductor chips. It is also useful for graduate and undergraduate students in electrical engineering, semiconductor sciences, and manufacturing sciences, and on courses involving the design of ESD devices, chips and systems. This book offers a useful insight into the issues that confront modern technology as we enter the nano-electronic era.
Harald Gossner System Level ESD Co-Design Harald Gossner System Level ESD Co-Design Новинка

Harald Gossner System Level ESD Co-Design

11020.02 руб.
An effective and cost efficient protection of electronic system against ESD stress pulses specified by IEC 61000-4-2 is paramount for any system design. This pioneering book presents the collective knowledge of system designers and system testing experts and state-of-the-art techniques for achieving efficient system-level ESD protection, with minimum impact on the system performance. All categories of system failures ranging from 'hard' to 'soft' types are considered to review simulation and tool applications that can be used. The principal focus of System Level ESD Co-Design is defining and establishing the importance of co-design efforts from both IC supplier and system builder perspectives. ESD designers often face challenges in meeting customers' system-level ESD requirements and, therefore, a clear understanding of the techniques presented here will facilitate effective simulation approaches leading to better solutions without compromising system performance. With contributions from Robert Ashton, Jeffrey Dunnihoo, Micheal Hopkins, Pratik Maheshwari, David Pomerenke, Wolfgang Reinprecht, and Matti Usumaki, readers benefit from hands-on experience and in-depth knowledge in topics ranging from ESD design and the physics of system ESD phenomena to tools and techniques to address soft failures and strategies to design ESD-robust systems that include mobile and automotive applications. The first dedicated resource to system-level ESD co-design, this is an essential reference for industry ESD designers, system builders, IC suppliers and customers and also Original Equipment Manufacturers (OEMs). Key features: Clarifies the concept of system level ESD protection. Introduces a co-design approach for ESD robust systems. Details soft and hard ESD fail mechanisms. Detailed protection strategies for both mobile and automotive applications. Explains simulation tools and methodology for system level ESD co-design and overviews available test methods and standards. Highlights economic benefits of system ESD co-design.
Steven Voldman H. ESD. Circuits and Devices Steven Voldman H. ESD. Circuits and Devices Новинка

Steven Voldman H. ESD. Circuits and Devices

8764.63 руб.
ESD: Circuits and Devices 2nd Edition provides a clear picture of layout and design of digital, analog, radio frequency (RF) and power applications for protection from electrostatic discharge (ESD), electrical overstress (EOS), and latchup phenomena from a generalist perspective and design synthesis practices providing optimum solutions in advanced technologies. New features in the 2nd edition: Expanded treatment of ESD and analog design of passive devices of resistors, capacitors, inductors, and active devices of diodes, bipolar junction transistors, MOSFETs, and FINFETs. Increased focus on ESD power clamps for power rails for CMOS, Bipolar, and BiCMOS. Co-synthesizing of semiconductor chip architecture and floor planning with ESD design practices for analog, and mixed signal applications Illustrates the influence of analog design practices on ESD design circuitry, from integration, synthesis and layout, to symmetry, matching, inter-digitation, and common centroid techniques. Increased emphasis on system-level testing conforming to IEC 61000-4-2 and IEC 61000-4-5. Improved coverage of low-capacitance ESD, scaling of devices and oxide scaling challenges. ESD: Circuits and Devices 2nd Edition is an essential reference to ESD, circuit & semiconductor engineers and quality, reliability &analysis engineers. It is also useful for graduate and undergraduate students in electrical engineering, semiconductor sciences, microelectronics and IC design.
Steven Voldman H. ESD Testing. From Components to Systems Steven Voldman H. ESD Testing. From Components to Systems Новинка

Steven Voldman H. ESD Testing. From Components to Systems

8764.63 руб.
With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). Describes both conventional testing and new testing techniques for both chip and system level evaluation. Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors’ series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work.
Steven Voldman H. ESD Basics. From Semiconductor Manufacturing to Product Use Steven Voldman H. ESD Basics. From Semiconductor Manufacturing to Product Use Новинка

Steven Voldman H. ESD Basics. From Semiconductor Manufacturing to Product Use

9288.9 руб.
Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips. The text is unique in covering semiconductor chip manufacturing issues, ESD semiconductor chip design, and system problems confronted today as well as the future of ESD phenomena and nano-technology. Look inside for extensive coverage on: The fundamentals of electrostatics, triboelectric charging, and how they relate to present day manufacturing environments of micro-electronics to nano-technology Semiconductor manufacturing handling and auditing processing to avoid ESD failures ESD, EOS, EMI, EMC, and latchup semiconductor component and system level testing to demonstrate product resilience from human body model (HBM), transmission line pulse (TLP), charged device model (CDM), human metal model (HMM), cable discharge events (CDE), to system level IEC 61000-4-2 tests ESD on-chip design and process manufacturing practices and solutions to improve ESD semiconductor chip solutions, also practical off-chip ESD protection and system level solutions to provide more robust systems System level concerns in servers, laptops, disk drives, cell phones, digital cameras, hand held devices, automobiles, and space applications Examples of ESD design for state-of-the-art technologies, including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, magnetic recording technology, micro-machines (MEMs) to nano-structures ESD Basics: From Semiconductor Manufacturing to Product Use complements the author’s series of books on ESD protection. For those new to the field, it is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic Era.
Steven Voldman H. Electrical Overstress (EOS). Devices, Circuits and Systems Steven Voldman H. Electrical Overstress (EOS). Devices, Circuits and Systems Новинка

Steven Voldman H. Electrical Overstress (EOS). Devices, Circuits and Systems

9288.9 руб.
Electrical Overstress (EOS) continues to impact semiconductor manufacturing, semiconductor components and systems as technologies scale from micro- to nano-electronics. This bookteaches the fundamentals of electrical overstress and how to minimize and mitigate EOS failures. The text provides a clear picture of EOS phenomena, EOS origins, EOS sources, EOS physics, EOS failure mechanisms, and EOS on-chip and system design. It provides an illuminating insight into the sources of EOS in manufacturing, integration of on-chip, and system level EOS protection networks, followed by examples in specific technologies, circuits, and chips. The book is unique in covering the EOS manufacturing issues from on-chip design and electronic design automation to factory-level EOS program management in today’s modern world. Look inside for extensive coverage on: Fundamentals of electrical overstress, from EOS physics, EOS time scales, safe operating area (SOA), to physical models for EOS phenomena EOS sources in today’s semiconductor manufacturing environment, and EOS program management, handling and EOS auditing processing to avoid EOS failures EOS failures in both semiconductor devices, circuits and system Discussion of how to distinguish between EOS events, and electrostatic discharge (ESD) events (e.g. such as human body model (HBM), charged device model (CDM), cable discharge events (CDM), charged board events (CBE), to system level IEC 61000-4-2 test events) EOS protection on-chip design practices and how they differ from ESD protection networks and solutions Discussion of EOS system level concerns in printed circuit boards (PCB), and manufacturing equipment Examples of EOS issues in state-of-the-art digital, analog and power technologies including CMOS, LDMOS, and BCD EOS design rule checking (DRC), LVS, and ERC electronic design automation (EDA) and how it is distinct from ESD EDA systems EOS testing and qualification techniques, and Practical off-chip ESD protection and system level solutions to provide more robust systems Electrical Overstress (EOS): Devices, Circuits and Systems is a continuation of the author’s series of books on ESD protection. It is an essential reference and a useful insight into the issues that confront modern technology as we enter the nano-electronic era.
Er-Ping Li Electrical Modeling and Design for 3D System Integration. 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC Er-Ping Li Electrical Modeling and Design for 3D System Integration. 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC Новинка

Er-Ping Li Electrical Modeling and Design for 3D System Integration. 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

10036.58 руб.
New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.
Joffe Elya B. Grounds for Grounding. A Circuit to System Handbook Joffe Elya B. Grounds for Grounding. A Circuit to System Handbook Новинка

Joffe Elya B. Grounds for Grounding. A Circuit to System Handbook

13908.96 руб.
Grounding design and installation is critical for the safety and performance of any electrical or electronic system. Blending theory and practice, this is the first book to provide a thorough approach to grounding from circuit to system. It covers: grounding for safety aspects in facilities, lightning, and NEMP; grounding in printed circuit board, cable shields, and enclosure grounding; and applications in fixed and mobile facilities on land, at sea, and in air. It?s an indispensable resource for electrical and electronic engineers concerned with the design of electronic circuits and systems.
Колонки автомобильные JVC CS-DR6930 500Вт 15x23см трехполосные Колонки автомобильные JVC CS-DR6930 500Вт 15x23см трехполосные Новинка

Колонки автомобильные JVC CS-DR6930 500Вт 15x23см трехполосные

2200 руб.
15 x 23cm (6' x 9') 3-Way Coaxial Speakers Функции • Трехполосные коаксиальные • 500W Peak/70W RMS Power • Frequency Response: 58 - 21,000Hz • Уровень звукового давления: 88 дБ/мВт • 15 x 23 cm (6'' x 9'') Carbon Mica Cone Woofer • 6.6cm (2-5/8'') Poly-Ether Imide Cone Midrange • 1.5 cm (19/32'') Poly-Ether Imide Dome Tweeter • Ферритовый магнит (НЧ-громкоговоритель) • Гибридная кромка из резины и ткани • Mounting Depth: 79 mm (3-1/8")
-ESD-3000 -ESD-3000 Новинка

-ESD-3000

1980 руб.
Цвет Белый Материал ABS пластик Объем 1000 мл Дозировка одного нажатия 1 мл Вес 0.65 кг Габариты 92х100х278 мм
ESD-1000 ESD-1000 Новинка

ESD-1000

1980 руб.
Цвет Белый Материал ABS пластик Объем 1000 мл Вес 1 кг Габариты 288x95x250 мм
Набор бит Wiha Micro-Bit ESD, 65 предметов Набор бит Wiha Micro-Bit ESD, 65 предметов Новинка

Набор бит Wiha Micro-Bit ESD, 65 предметов

9150 руб.
Набор бит Wiha "Micro bit" предназначен для высокоточных работ со сменным инструментом. Набор, выполненный из высококачественной хромванадиевой стали с антистатической рукояткой, удлинителем, адаптером и трещоткой отлично подходит для прецизионных работ со специальными винтами в технике Apple. Диссипативная рукоятка-битодержатель надежно отводит электростатический заряд и имеет поверхностное сопротивление 106-109 мОм. Удлинитель для рукоятки-битодержателя ESD Micro-Bits 4 мм для работы в труднодоступных местах. В комплекте: шлиц (SL), шестигранник (SW), Torx (T), Pentalobe (PL), крестовой (PH), головка шестигранная (SW), переходник 1/4" - Micro-Bits, трещотка 1/4" реверсивная с храповиком 5 градусов, рукоятка-битодержатель ESD Micro-Bits 4 мм. Набор упакован в пластиковый кейс. Рекомендуем!
Отвертка Precision 277 ESD торцевая головка SW1,5x60 Wiha 32312 Отвертка Precision 277 ESD торцевая головка SW1,5x60 Wiha 32312 Новинка

Отвертка Precision 277 ESD торцевая головка SW1,5x60 Wiha 32312

671 руб.
Отвертка с торцевой головкой Wiha "Precision ESD" с шестигранником. Оснащена диссипативной рукоятка, отводящей электростатический заряд. Жало выполнено из хромованадиевой стали полной закалки с матовым хромированием. Рукоятка Precision с крутящимся колпачком, поверхностное сопротивление 106-109 Ом. Применяется для любых работ с деталями, подверженными воздействию электростатического заряда. Нормы: IEC 61340-5-1. Общая длина отвертки: 14 см. Длина жала: 6 см. Размер ручки: 8 см х 1,2 см х 1,2 см.
Обложка для паспорта Printio Dark side Обложка для паспорта Printio Dark side Новинка

Обложка для паспорта Printio Dark side

750 руб.
Обложка для паспорта — материал: Полиэстер. Black passport cover with white picture. I want you for the dark side.
Zhang Bo Sneak Circuits of Power Electronic Converters Zhang Bo Sneak Circuits of Power Electronic Converters Новинка

Zhang Bo Sneak Circuits of Power Electronic Converters

13434.79 руб.
The first treatment of advanced knowledge of electrical sneak circuits and its analysis method in power electronics The work on sneak circuit and its analysis methods for power converters contributes to the reliability of power electronic systems worldwide. Most books in the subject concentrate on electronic systems, but this book is perhaps the first to examine power electronic systems. It describes the sneak circuit phenomena in power converters, introduces some SCA methods for power electronic systems and proposes how to eliminate and make use of sneak circuits. The book is divided into three separate sections. Firstly, the sneak circuit paths and sneak circuit operating conditions are discussed in different kinds of power converters, including resonant switched capacitor converters, basic DC-DC converters, soft-switching converters and Z-source converters; Secondly, the sneak circuit analysis guidelines for power converters based on generalized matrix, adjacency matrix and Boolean matrix are presented respectively; Thirdly, the sneak circuit elimination techniques are introduced and verified in several power converters, with applications of sneak circuits described in conclusion. Written by a lead author with extensive academic and industrial experience, the book provides a complete introduction and reference to students and professionals alike. Contents include: Fundamental Concepts, SCA of Resonant Switched Capacitor Converters, SC of DC-DC Converters, SC Analysis Method (including Boolian Matrix), and Applications of SC in Power Converters. Highlights the advanced research works in the sneak circuit analysis, by a leading author in the field Original in its treatment of power electronics converters; most other books concentrating on electronics systems, and aimed at both introductory and advanced levels Offers guidelines for industry professionals involved in the design of power electronic systems, enabling early detection of potential problems Essential reading for Graduate students in Electrical Engineering: Engineers and Researchers in Power Electronics
Wella SAHIRA Anti-Static фен c насадкой-соплом Wella SAHIRA Anti-Static фен c насадкой-соплом Новинка

Wella SAHIRA Anti-Static фен c насадкой-соплом

6975 руб.
Sahira Anti-Static – инновационная функция «Антистатик» позволяет устранить проявление статического электричества на волосах, облегчает укладку волос и позволяет им дольше сохранять желаемую форму. Волосы становятся более блестящими и ухоженными. Технические характеристики • Мощность: 1 600 Вт. • Уровень нагрева и силы потока воздуха: 2 скорости / 3 уровня нагрева воздуха. • Кнопка подачи холодного воздуха: 1. • Цвет: хром / антрацит.
Материнская плата Asus, H110M-A/DP/C/SI Материнская плата Asus, H110M-A/DP/C/SI Новинка

Материнская плата Asus, H110M-A/DP/C/SI

4792 руб.
Задняя панель материнских плат ASUS изготавливается из нержавеющей стали, покрытой тонким слоем оксида хрома, который обладает антикоррозийными свойствами. Благодаря этому она может похвастать долгим сроком службы. ESD Guards.
Ed Lipiansky Electrical, Electronics, and Digital Hardware Essentials for Scientists and Engineers Ed Lipiansky Electrical, Electronics, and Digital Hardware Essentials for Scientists and Engineers Новинка

Ed Lipiansky Electrical, Electronics, and Digital Hardware Essentials for Scientists and Engineers

10431.72 руб.
A practical guide for solving real-world circuit board problems Electrical, Electronics, and Digital Hardware Essentials for Scientists and Engineers arms engineers with the tools they need to test, evaluate, and solve circuit board problems. It explores a wide range of circuit analysis topics, supplementing the material with detailed circuit examples and extensive illustrations. The pros and cons of various methods of analysis, fundamental applications of electronic hardware, and issues in logic design are also thoroughly examined. The author draws on more than twenty-five years of experience in Silicon Valley to present a plethora of troubleshooting techniques readers can use in real-life situations. Plus, he devotes an entire chapter to the design of a small CPU, including all critical elements—the complete machine instruction set, from its execution path to logic implementation and timing analysis, along with power decoupling, resets, and clock considerations. Electrical, Electronics, and Digital Hardware Essentials for Scientists and Engineers covers: Resistors, inductors, and capacitors as well as a variety of analytical methods The elements of magnetism—an often overlooked topic in similar books Time domain and frequency analyses of circuit behavior Numerous electronics, from operational amplifiers to MOSFET transistors Both basic and advanced logic design principles and techniques This remarkable, highly practical book is a must-have resource for solid state circuit engineers, semiconductor designers and engineers, electric circuit testing engineers, and anyone dealing with everyday circuit analysis problems. A solutions manual is available to instructors. Please email [email protected] to request the solutions manual. An errata sheet is available.
SKIN79 Kick It Side Thick Brush - Кисть Кабуки SKIN79 Kick It Side Thick Brush - Кисть Кабуки Новинка

SKIN79 Kick It Side Thick Brush - Кисть Кабуки

1160 руб.
Густой синтетический ворс кисти обеспечивает легкое и удобное нанесение средства на кожу. Короткая ручка дает дополнительное удобство при нанесении. Кисть позволяет наносить средство как густым и плотным слоем, так и легким, почти прозрачным покрытием кожи.
Ralph Morrison Fast Circuit Boards. Energy Management Ralph Morrison Fast Circuit Boards. Energy Management Новинка

Ralph Morrison Fast Circuit Boards. Energy Management

7836.96 руб.
An essential guide to modern circuit board design based on simple physics and practical applications The fundamentals taught in circuit theory were never intended to work above a few megahertz, let alone at a gigahertz. While electronics is grounded in physics, most engineers’ education in this area is too general and mathematical to be easily applied to the problem of high speed circuits. Left to their own devices, many engineers produce layouts that require expensive revisions in order to finally meet specifications. Fast Circuit Boards fills the gap in knowledge by providing clear, down-to-earth guidance on designing digital circuit boards that function at high clock rates. By making the direct connection between physics and fast circuits, this book instills the fundamental universal principles of information transfer to give engineers a solid basis for hardware design. Using simple tools, simple physics, and simple language, this invaluable resource walks through basic electrostatics, magnetics, wave mechanics, and more to bring the right technology down to the working level. Designed to be directly relevant and immediately useful to circuit board designers, this book: Properly explains the problems of fast logic and the appropriate tools Applies basic principles of physics to the art of laying out circuit boards Simplifies essential concepts scaled up to the gigahertz level, saving time, money, and the need for revisions Goes beyond circuit theory to provide a deep, intuitive understanding of the mechanisms at work Demonstrates energy management’s role in board design through step function-focused transmission line techniques Engineers and technicians seeking a more systematic approach to board design and a deeper understanding of the fundamental principles at work will find tremendous value in this highly practical, long-awaited text.
Футболка с полной запечаткой (мужская) Printio Crash poly Футболка с полной запечаткой (мужская) Printio Crash poly Новинка

Футболка с полной запечаткой (мужская) Printio Crash poly

1190 руб.
Футболка с полной запечаткой (мужская) — пол: Муж, материал: Синтетика. Авторский арт в стиле Low-poly. Что такое Low Poly Art? Low-poly (от английского low — низко и polygon — полигон) — трехмерная модель с небольшим числом полигонов.
Футболка с полной запечаткой для девочек Printio Crash poly Футболка с полной запечаткой для девочек Printio Crash poly Новинка

Футболка с полной запечаткой для девочек Printio Crash poly

1190 руб.
Футболка с полной запечаткой для девочек. Авторский арт в стиле Low-poly. Что такое Low Poly Art? Low-poly (от английского low — низко и polygon — полигон) — трехмерная модель с небольшим числом полигонов.
Футболка с полной запечаткой для мальчиков Printio Crash poly Футболка с полной запечаткой для мальчиков Printio Crash poly Новинка

Футболка с полной запечаткой для мальчиков Printio Crash poly

1190 руб.
Футболка с полной запечаткой для мальчиков. Авторский арт в стиле Low-poly. Что такое Low Poly Art? Low-poly (от английского low — низко и polygon — полигон) — трехмерная модель с небольшим числом полигонов.
Футболка с полной запечаткой для мальчиков Printio Crash poly Футболка с полной запечаткой для мальчиков Printio Crash poly Новинка

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1190 руб.
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A comprehensive and in-depth review of analog circuit layout, schematic architecture, device, power network and ESD design This book will provide a balanced overview of analog circuit design layout, analog circuit schematic development, architecture of chips, and ESD design. It will start at an introductory level and will bring the reader right up to the state-of-the-art. Two critical design aspects for analog and power integrated circuits are combined. The first design aspect covers analog circuit design techniques to achieve the desired circuit performance. The second and main aspect presents the additional challenges associated with the design of adequate and effective ESD protection elements and schemes. A comprehensive list of practical application examples is used to demonstrate the successful combination of both techniques and any potential design trade-offs. Chapter One looks at analog design discipline, including layout and analog matching and analog layout design practices. Chapter Two discusses analog design with circuits, examining: single transistor amplifiers; multi-transistor amplifiers; active loads and more. The third chapter covers analog design layout (also MOSFET layout), before Chapters Four and Five discuss analog design synthesis. The next chapters introduce the reader to analog-digital mixed signal design synthesis, analog signal pin ESD networks, and analog ESD power clamps. Chapter Nine, the last chapter, covers ESD design in analog applications. Clearly describes analog design fundamentals (circuit fundamentals) as well as outlining the various ESD implications Covers a large breadth of subjects and technologies, such as CMOS, LDMOS, BCD, SOI, and thick body SOI Establishes an “ESD analog design” discipline that distinguishes itself from the alternative ESD digital design focus Focuses on circuit and circuit design applications Assessible, with the artwork and tutorial style of the ESD book series PowerPoint slides are available for university faculty members Even in the world of digital circuits, analog and power circuits are two very important but under-addressed topics, especially from the ESD aspect. Dr. Voldman’s new book will serve as an essential and practical guide to the greater IC community. With high practical and academic values this book is a “bible” for professionals, graduate students, device and circuit designers for investigating the physics of ESD and for product designs and testing.
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